Thermal Control for In-Silicon Circuit Analysis

Presto has developed a break-through adeptness to address the allegation to avant-garde accurate temperature control while adventuresome in-silicon abuttals analysis. Advanced back-side appraisement techniques crave thermal solutions to acclimatize to a exhausted acclimation of lenses, including air-gap, aqueous and solid captivation (SIL). Additionally, new designs targeting chump and adjustable applica-tions crave not abandoned cooling, but additionally allegation precise thermal advantage during aborticide appraisement able docked ATE through-out the operating temperature range.

The patent-pending Allegheny is a moveable, diamond calefaction spreader, acclimatized complete thermal control. It is accordant with best bartering failure analysis equipment, including absolution and laser micro- scopes, laser voltage probers and automatic probers. Allegheny can handle accessories administering over 30 atts, afterwards aqueous or acquire cooling.

KEY FEATURES
• Flexible, all-lens thermal control
• Abandoned band-aid for accessories administering > 300W
• Temperature adventuresome -65C to +125C
• Easy to deploy, no liquids or plumbing
• DUT Clamp requires basal device-dependent customization

The appetence of thermal advantage systems is to provide the widest abuttals of temperatures at the highest possible adeptness dissipation. To be e ective it must exceed the best case adeptness of production packages to acquire adventuresome of adversity case conditions. Typical cooling solutions accoutrement afflicted air or liquids are able for production. Character- ization requires a affiliated of adeptness able beyond these changeabout techniques. Conduction provides several orders of aftereffect academy thermal conduc-tivity. Diamond has the able thermal conductivity of all abstracts by a exhausted margin, accurate it the ideal heat spreader material.

The innovative Allegheny system combines a diamond-based heat-spreader with a novel method to clamp the device-under-test (DUT). The patent pending system can be installed in most state-of-the-art backside in-silicon analysis systems and enables imaging with air-gap and immersion lenses. In addition, it does not require liquid to be in contact with the DUT, thereby enabling higher-power density devices to be analyzed in-silicon while being tested – the most advanced method for modern semiconductor bring-up and failure analysis.


Allegheny accommodates most packages and is easily adaptable to customer sockets. The system allows all optical analysis techniques to be performed through its diamond window, while maintaining the device temperature across the full commercial range, for precise silicon analysis. With its unique thermal conduc-tion e ciency, device temperature can be held within a predictable range, even at power levels beyond 300 watts. Allegheny is also designed for use on mechanical probing stations, enabling high-power DC and one-shot, in-circuit timing measurements.